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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL

Shenzhen Bicheng Electronics Technology Co., Ltd
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Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL

Brand Name : Bicheng Technologies Limited

Model Number : BIC-0099-V3.7

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-5.99 per piece

Payment Terms : T/T, Paypal

Supply Ability : 45000 pieces per month

Delivery Time : 6-7 working days

Packaging Details : Vacuum

Number of Layers : 2

Glass Epoxy : RO3006

Final foil external : 1.0oz

Final height of PCB : 1.3 mm ±10%

Surface Finish : Immersion Gold

Solder Mask Color : No

Colour of Component Legend : Black

Test : 100% Electrical Test prior shipment

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Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL
(PCB's are custom-made products, the picture and parameters shown are just for reference)


Hello everyone,
Today we’re talk about RO3006 high frequency PCBs.

RO3006 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL

More features and applications are as follows:
1. excellent mechanical properties versus temperature, it’s reliable for stripline and multi-layer board constructions.
2. uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.
3. low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

Our PCB Capability (RO3006)

PCB Material:Ceramic-filled PTFE composite
Designation:RO3006
Dielectric constant:6.15 ±0.3 (process)
6.5 (design)
Layer count:2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 25mil (0.635mm)
50mil (1.27mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  


RO3006 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL

Typical applications
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite

Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL

The basic colour of RO3006 PCB is white.

The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet RO3006

RO3006 Typical Value
PropertyRO3006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign6.5Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.002Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-262Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.27
0.15
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105 COND AIPC 2.5.17.1
Tensile Modulus1498
1293
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.02 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.86 j/g/k Calculated
Thermal Conductivity0.79 W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 ℃ TGA ASTM D 3850
Density2.6 gm/cm323℃ASTM D 792
Copper Peel Stength7.1 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0 UL 94
Lead-free Process CompatibleYes
Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil, 25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL











































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